Ether bond/alkylene group/F HFBAPP
Transparent resin / for low dielectric constant and low dielectric loss tangent! 5G resin, semiconductor applications, foldable materials, Under Display Camera.
We would like to introduce "HFBAPP," which is handled by Seika. In addition to the products listed on our website, we offer a variety of other products. If you are considering samples or quotes, please feel free to contact us. 【Features】 ■Compound Name: 2,2-Bis[4-(4-aminophenoxy)phenyl]hexafluoropropane ■Chemical Formula: C27H20F6N2O2 ■M.W. (Molecular Weight): 518.45 ■CAS No.: 69563-88-8 ■Melting Point: 160℃ *For more details, please refer to the related links or feel free to contact us.
- 企業：セイカ
- 価格：Other
